레이저마킹기

Fiber Tower™ Series (레이저마킹기/레이저마커)

Q-Switched Fiber Laser Marking Systems are a safe, state-of-the-art, low-cost Direct Part Marking (DPM) alternative for laser marking with Nd:YAG and Nd:YVO4 Lasers.

The Fiber Tower™ Series Q-Switched Fiber Laser Marking Systems are a safe, state-of-the-art, low-cost Direct Part Marking (DPM) alternative for laser marking with Nd:YAG and Nd:YVO4 Lasers. Components include a q-switched fiber laser with scan head, PC with control board, power supply, software, and a laser safety enclosure.

Standard configurations of the FiberTower™ marking systems allow for many different options to meet any production need. Available options include programmable Z-axis for focal height adjustments, rotary indexers for circumferential marking, rotary dial tables for simultaneous mark and lase operation and X-Y motion systems for increased marking areas. Additional features include ease of installation allowing for quick start-up and graphical-based programming for a minimal learning curve. Requirements beyond those listed above will be quoted upon request.

Fiber lasers are a great leap forward in laser technology. Our fiber lasers are more easily integrated into industrial processes in comparison with conventional lasers due to:

• Standard wall plug operation and high electrical efficiency
• Single mode fiber delivery line
• Fiber delivery up to 50 meters (for CW lasers)
• Up to 200 Watts optical output power both CW or q-switched
• High quality focusable beam (TEMoo)
• High repetition rate
• Optimized pulse duration
• Exceptionally high reliability
• Maintenance-free operation
• Very high MTBF (100.00 hours typical on diods)
• >30,000 hours estimated maintenance-free operation
• Excellent beam quality (M2 < 1.05)
• Linear polarization options
• Compact package
• No water cooling

Blackstar: Silicon Dicing System

BLACK STAR™

Zero Width Dicing Technology™

BLACK STAR™ is a latest development of Zero Width Dicing Technology™ (ZWDT™) for semiconductor wafers of different thicknesses and composition.

LASER

• Proprietary Type 

WAFER

• Wafer thickness - 50µ to 700µ.
• Wafer size - 12" max.
• Frame: Standard types (8” or 12")
• Holding tape: standard low tack

VISION SYSTEM

• Two-level Magnification 
• Optical zoom
• Type: Pattern Recognition with
• Automatic alignment

MOTION SYSTEM

• 4 axis direct drive servo platform.
• Working area 500 x 500 mm
• Maximum axis speed 500 mm/s

FPD Laser Cutting Systems (레이저커터)

SBM1200CF

We provide the state-of-the-art non dimensional laser scribing and dicing solutions to customers in FPD and Semiconductor industries throughout the world.

SBM777G

The first in the world laser scribing system with simultaneous scribe and break capabilities for singulation of Flat Panel Displays

Advantages of our Industrial Laser Cutting and Engraving Systems over Competitors'

• Direct drive structure means no belts, no rotary encoders, no gears, no wear, higher acceleration, higher cutting speed, and increased accuracy due to no belt vibration.
• We can offer high power lasers, due to the use of direct drive, while our competitors can only use low power lasers because weight affects accuracy on belt systems.
• 12" clearance under the cutting head with 2" of Z-travel. Competing machines have no clearance.
• Enclosed laser beam protects optics and mirrors from environmental contamination
• Purged gas: compressed air or Nitrogen (N2) protects the cutting head
• Sealed, high-quality linear bearings lubricated for life
• High-pressure cutting nozel with Oxygen (O2) or Nitrogen (N2) assisted gas for high-speed, clean cutting
• Software aligns the perpindicularity of the X and Y axes
• Computer-controlled Z position
• Easily replaceable focus heads for 2.5", 3.75", and 5.0" focal lengths
• Replaceable 51" x 52" nesting baskets for different support surfaces: aluminum grating, honeycomb, and vaccuum holding tables
• Extra-large aperture on the beam benders and focusing optics allow connections of up to 1,500w CW or 3,000w pulsed lasers
• Forced air cooling of the beam benders and focusing optics for stability
• Ability to use the built-in sealed laser or standalone high-powered laser
• The latest generation of motion controllers integrate laser control functions, provide the fastest processing speeds, and optimize trajectory
• Inline integration is possible because there is no shaft and it is not an enclosure
• Our head is industrial, fully sealed, and capable of high pressure
• For metal applications our systems are equipped with 45 degree polarization optics to ensure high-quality, even cutting in both directions
• For reflective materials, we use an optical isolator to protect the laser

The SBM 1200M Laser Cutting and Engraving System combines flying optics with a precision Direct Drive motion system. System provides highly accurate cutting, welding, engraving and marking capabilities for multiple materials.

• Ease of installation allows for quick start-up.
• Handles continuous roll and standard sheet size stock.
• 4' x 4' cutting area.
• Can be equipped with sealed laser from 50 to 1000 watt. 
• More on the SBM 1200M

The SBM2800 is a Large format Laser Patten cutter for ship building, automotive and aerospace industries.

• Extra large cutting area 127.5” x 192” (3048 x 5067 mm).
• System is designed to cut Template Paper, Plywood, and Cypress Board at the same time on the same machine.
• Automatic feeding and take-up function for paper rolls is optional.
• More on the SBM2800

Fiber Tower™ Series of fiber laser marking and engraving systems

• The FiberTower systems are capable of meeting your Direct-Part-Marking needs. Simply plug the compact system into any 110VAC outlet and you are in business producing high quality marks on production parts.